CFast
Ultra iSLC 解決方案
CFast 3IE7
特點
- 提供高達 10 萬抹寫次數（P/E Cycle）、壽命延長 33 倍
- 採用宜鼎獨家 Ultra iSLC 技術
- 採用 BiCS5 112 層 3D TLC 快閃記憶體
- 支援 -40°C 至 85°C 的溫度範圍
- 提供 5 年保固與長穩供貨承諾
CFast 3IE7 是基於 SATA III 6.0 Gb/s 專為工業應用設計的快閃儲存裝置。搭載宜鼎獨家 Ultra iSLC 技術，提供高達 10 萬次的抹寫次數，大幅提升裝置效能。此外，內建溫度感測器（Thermal Sensor）與 iData Guard 等功能，能確保 CFast 3IE7在工業應用中的資料完整性與可靠性。
Ultra iSLC 技術：10 萬次抹寫、壽命提升 33 倍
宜鼎新一代獨家 Ultra iSLC 技術，透過韌體技術突破，搭配 BiCS5 112 層 3D TLC 快閃記憶體，將 CFast 3IE7 的抹寫次數（P/E Cycle）推升至 10 萬次，較傳統 3D TLC 快閃記憶體提升多達 33 倍的使用壽命。
iData Guard 資料保護技術
iPower Guard 電源保護技術
探索多元應用場景與成功實例
ENSURING HIGH-ENDURANCE AND DATA INTEGRITY IN GAMING MACHINES
In the competitive world of gaming machines, ensuring data integrity and reliable performance is crucial to success. Manufacturers face significant challenges due to the compact and high-temperature environments inside gaming machines, coupled with the demanding read/write workloads required for seamless operation.
EMPOWERING TELECOM NETWORKS: OVERCOMING DATA OVERLOAD WITH iSLC TECHNOLOGY
In today's fast-evolving telecommunications landscape, the demand for intensive network transmissions has reached unprecedented levels. For leading telecommunications service providers, this rapid surge brings a series of intricate challenges that demand immediate attention.
規格表
| Model Name | CFast 3IE7 |
|---|---|
| Flash Type | iSLC (3D TLC) |
| Interface | SATA III 6.0 Gb/s |
| Form Factor | CFast 2.0 |
| Capacity | 20GB ~ 320GB |
| Sequential R / W (MB/sec, max.) | 560 / 500 |
| P/E Cycle | 30,000 / 100,000 |
| TBW (Max.) | 20,000 |
| Storage Temperature | -40°C ~ 85°C |
| Max. Power Consumption | 2.0W |
| Max. Channels | 4 |
| External DRAM Buffer | N |
| Feature | AES, H/W Write Protect, S.M.A.R.T. |
| Dimension (W x L x H/mm) | 42.8 x 36.4 x 3.6 |
| Vibration | 20G@[7 ~ 2000Hz] |
| Shock | 1500G@0.5ms |
| MTBF | >3 million hours |
| Warranty | 5 Years |
產品料號
運作溫度 | 標準溫度 (0°C ~ 70°C) | 工業級溫度 (-40°C ~ 85°C) |
20GB | DHCFA-20GDK1%C*&F(W) | DHCFA-20GDK1%W*&F(W) |
40GB | DHCFA-40GDK1%C*&F(W) | DHCFA-40GDK1%W*&F(W) |
80GB | DHCFA-80GDK1%C*QF(W) | DHCFA-80GDK1%W*QF(W) |
160GB | DHCFA-A60DK1%C*QF(W) | DHCFA-A60DK1%W*QF(W) |
320GB | DHCFA-D2GDK1%C*QF(W) | DHCFA-D2GDK1%W*QF(W) |
W. H/W Write Protect
%. E : 64 layers 3D TLC / K : 112 layers 3D TLC
*. PCB version control
&. S : 1 channel / D : 2 channels / Q : 4 channels
