Choosing Reliability: A Guide to Selecting DRAM with Enhanced Features for Your Needs

In industrial applications, Dynamic Random Access Memory (DRAM) stands as a crucial player, transcending its conventional role as not just a storage component. Today, we delve into the complex world of environmental challenges within industrial settings, where vibration and unpredictable temperature changes are prevalent. While the automatic response to harsh conditions often leans towards selecting “wide-temperature” products, in reality, this alone is insufficient! In these demanding scenarios, conventional memory solutions fall short, necessitating innovative approaches for optimal performance and prolonged longevity. 

 

Heat Spreader: Optimal Cooling Solution

The industrial landscape has evolved into a multitude of diverse and intricate environments, ranging from aerospace to agricultural AI detection. As a result, the challenges we face have become increasingly complex. Numerous components contribute to heightened temperatures during module operation, presenting a significant hurdle for businesses. Among these challenges, rising heat emerges as a prominent issue.

Heat spreaders play a vital role in efficiently dissipating heat to tackle temperature challenges. In various industries, these heat spreaders are commonly crafted from aluminum or aluminum alloy. They may also utilize thermal paste or pads to seamlessly adhere to the DRAM module, ensuring effective heat dispersal. Innodisk's specially designed DDR5 long DIMM heat spreader not only facilitates passive heat dissipation but also takes proactive measures to reinforce connections in its product design. By featuring a secure connection with screw holes, this design aligns perfectly with the prevalent vibrations in the customer's environment. When paired with thermal interface material (TIM), such as a thermal pad with a heat transfer coefficient 100 times higher than air, this method effectively dissipates system heat, offering enhanced reliability and performance.  
 

TIM can fully cover the components on the PCB board.
 

The material of the thermal pad we selected can fully cover the components.

Rugged Clips: Strengthening Physical Integrity

In settings where vibrations are intense, securing DIMMs onto sockets poses a significant challenge. Conventional fixes, such as rubber bands and glue bars, might disrupt component functionality, complicate disassembly, and even risk warranties because they stick directly to the modules.

Innodisk tackles this issue by introducing our patent rugged clips crafted from the robust material PANLITE®. These clips serve as an economical and effective remedy against vibrations during shipping and rugged usage. Following EIA 364-28 VII vibration testing, our DRAM modules demonstrate continued functionality while securely seated in their slots, even under vibrations as intense as 3Grms. By enhancing connections on DIMM sockets without directly touching the modules, Innodisk’s Rugged Clips provides a straightforward, cost-effective, and thoroughly tested solution to prevent DRAM modules from dislodging from DIMM slots. 

Coating: Protection against Environmental Risks

In harsh industrial settings filled with dust, air pollution, humidity, and chemical corrosion, electronic components face a constant threat, impacting overall system performance. Conformal coating emerges as a protective solution to safeguard against these challenges. However, concerns often revolve around coating thickness and uniformity.

Innodisk’s DRAM modules, equipped with this protective coating, have been actively utilized in the server deployed at an F1 racetrack. In this rigorous setting, where carbon fiber particles abound and pose a threat to components and fans, the coating layer serves as a shield, safeguarding against potential scratches or disruption to the operation of these critical components. Innodisk’s DRAM modules feature conformal coating, guaranteeing not only uniformity, thickness, and integrity but also a perfect fit within DIMM sockets.

Side Fill: Elevating the Robustness and Stability

In industrial environments, modules are frequently exposed to elevated temperatures and harsh conditions, leaving PCBs susceptible to environmental factors. This vulnerability can result in unstable solder joints or balls, leading to circuit interruptions during temperature fluctuations. In order to strengthen the products, the industrial sector commonly employs techniques like side fill and underfill. Repairing underfill is comparatively more challenging and can lead to increased heat accumulation, especially when compared to side fill.

Side fill offers easier maintenance and a lower risk of heat buildup due to its open design. This makes it the preferred choice in situations where accessibility and heat management are critical. Innodisk's side fill technology undergoes thorough pull testing to ensure durability and reliability. Capable of withstanding external forces of 40 kilograms-force (kgf) or more, the DRAM IC remains securely fixed to the PCB board, maintaining functionality even under extreme conditions.

Our side fill applies a coating to only three sides, effectively managing heat during DRAM IC operation while also simplifying maintenance procedures when necessary. This approach offers both strength and flexibility to individual components, ensuring a robust and dependable connection. 
 

Benefits of Value-Added Features:

The features collectively contribute to the reliability, durability, and performance of DRAM modules. 

Wrapping up, among the growing complexities of real-world applications, the added features within our DRAM modules emerge as indispensable tools for tackling a multitude of challenges. Each advancement, whether the effective Heat Spreader, sturdy Rugged Clips, defensive Coating, or strong Side Fill, substantially reinforces the strength of our modules. At Innodisk, our DRAM solutions are crafted to fortify module strength, guaranteeing peak performance in diverse scenarios. These features not only boost reliability and durability but also shield against potential issues from the environment, ensuring our modules stand the test of time.