
Qualcomm-Lösung
COM-HPC Mini Starter Kit
EXEC-Q911
Powered by : Qualcomm Dragonwing™ IQ-9075 SoC
Provides : Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
Features :
- Ready-to-use starter kit with COM-HPC Mini Module and carrier board
- Up to 36 GB onboard memory and 128 GB UFS 3.1 storage
- Dual 2.5G Ethernet and dual 4-lane MIPI CSI-2 interfaces
- Industrial-grade design with operating temperature range from -40°C to 85°C (Ta)
- Long-term chipset longevity supported through 2038
Innodisk offers a broad range of edge AI platform options. Within its AI on ARM product portfolio, the AI on Dragonwing series is built on Qualcomm’s latest technologies.
The Innodisk EXEC-Q911 is a complete starter kit featuring a COM-HPC Mini Module and carrier board for immediate development and evaluation. The COM-HPC Mini Module leverages Qualcomm’s latest innovation—the Dragonwing™ IQ-9075 SoC—to deliver high AI computing performance with low power consumption. Combined with Innodisk’s comprehensive customization services and self-developed software toolkit, it provides customers with a fast, time-to-market solution to stay ahead in the edge AI era.
POWERED BY QUALCOMM DRAGONWING™ SoCs
Best known for semiconductor leadership, Qualcomm introduced its brand-new “Dragonwing™” AI SoC portfolio, designed for the IoT, industrial, enterprise, and networking markets in the AI era.
Innodisk leverages this innovation to develop the EXEC-Q911 starter kit, integrating a COM-HPC Mini Module and carrier board to deliver ready-to-use, high-performance, reliable, and scalable on-device AI computing with low power consumption at the edge.

VERIFIED PERFORMANCE, TRUSTED AI INFERENCE
Offering up to 100 TOPS (Dense) / 200 TOPS (Sparse) of AI computing, the module is tested and verified in real-world workloads, delivering excellent inference speed and performance across vision computing AI models and generative models.





Note 1:
- Both solutions are configured with power consumption below the 30W standard
- The other solution is set to Mode_30W
- The Qualcomm solution is set to htp_performance_mode: 2
- Input resolution: YOLO Series – 640×640; UNet-Seg – 640×1280; ResNet-50 – 224×224
Note 2:
- Dense computation: A reliable and straightforward metric representing the peak compute capability of a processing unit for neural network workloads.
- Sparse computation: Achieves higher effective compute performance (TOPS) and efficiency by skipping zeros or redundant weights. However, it requires careful model design to minimize potential accuracy loss.
TIME TO MARKET, COMPACT COM-HPC MINI STARTER KIT
The EXEC-Q911 starter kit, designed with a COM-HPC Mini computing module, delivers high performance in a compact and scalable module. Built under the PICMG COM-HPC® Mini specification, it represents the next generation beyond COM Express Mini, delivering higher performance and richer connectivity.

Featuring high-speed interfaces and I/O such as PCIe Gen4, USB 3.2, 2.5 GbE LAN, UART, RS-232/422/485, SPI, CAN FD, I²C, and GPIO, the COM-HPC Mini module enables robust connectivity and expansion for space-constrained edge AI and embedded applications.
Combined with a fully compatible carrier board, the EXEC-Q911 starter kit helps shorten development cycles while delivering maximum flexibility and reduced implementation risk.

IQ STUDIO — ALL-IN-ONE DEVELOPMENT TOOLKIT
Introducing IQ Studio — Innodisk‘s quick-start portal that empowers AI applications and accelerates edge deployment. IQ Studio serves as a one-stop platform providing BSPs, AI sample applications, benchmarking, and testing tools—all within an integrated development environment.
Streamline workflows, reduce setup time, and drive the rollout of edge AI solutions.
Explore on GitHub >

EXPAND BEYOND LIMITS — CAMERA, STORAGE, AND I/O
The Qualcomm Dragonwing™-powered COM-HPC Mini is where edge AI begins — and with Innodisk’s proven, fully compatible expansion options, we enable diverse applications and deliver a faster, simpler path to deployment.
Innodisk‘s camera modules bring AI vision to life, while high-performance SSDs and full-spectrum I/O expansion cards can be tailored to meet the unique needs of any AI application.

QUALCOMM AI HUB – TEST AND DEPLOY FASTER
Qualcomm AI Hub offers over 100 validated AI models for Qualcomm edge devices, covering vision, speech, and generative AI applications such as YOLO, ResNet, and UNetSeg. Developers can easily find suitable AI models by selecting target CPU, test performance, and deploy them to edge devices within minutes.
Explore on GitHub > Explore Qualcomm AI Hub >
The platform supports TFLite, QNN, and ONNX, fully leveraging Qualcomm’s heterogeneous computing architecture (NPU / CPU / GPU) for high performance and low power consumption at the edge.

TAILORED TO YOUR SPECIFIC NEEDS
FASTER CARRIER BOARD DEVELOPMENT WITH BSP
The EXEC-Q911 starter kit includes a fully compatible carrier board for an easy development start. For custom designs, Innodisk BSP and Metalayer enable flexible I/O customization—reducing risk and accelerating time to market.

MODULAR I/O EXPANSION FOR DIVERSE APPLICATIONS
With reliable expansion modules including CAN Bus, CAN FD, 10GbE LAN, and RS-232/422/485, Innodisk offers flexible I/O options for AGV, AMR, and other applications—streamlining integration and hardware design.

SPEZIFIKATIONEN
| Module Name | EXEC-Q911 |
|---|---|
| Module Form Factor | COM-HPC Mini |
| CPU | Qualcomm Dragonwing™ IQ-9075 SoC (Octa-core Kyro Gen 6 : 8x Kryo Gold Prime @2.36GHz) |
| Graphics | Adreno 663 GPU |
| Memory | 36GB LPDDR5X |
| Storage | 128GB UFS 3.1 |
| AI Engine | 100 TOPS (Dense) / 200 TOPS (Sparse) via 2 x NPU Hexagon Tensor Processor |
| Expansion | M.2 2280 M Key:1 x PCIe Gen 4 x4 M.2 3052 B Key:USB 3.2 Gen 2, USB2.0* M.2 2230 E Key:1 x PCIe Gen 4 x2 , USB 2.0 |
| MIPI | MIPI CSI-2:2 x 4-lane MIPI CSI-2 (22pin, P : 0.5, on module) |
| Ethernet | LAN:2 x 2.5GbE RJ45 |
| Display | DP1.2:2 eDP:1 |
| Audio | MIC In / LINE Out:Phone Jack 3.5mm AMP Out:Wafer (1 x 4) |
| External I/O | • USB 3.2 Gen 2 x1 (10Gbps):3 • USB 3.2 Gen 2 x1 (10Gbps) Type-C:1 (OTG support)* • USB 2.0:2 • Buttons:1 x Power, 1 x Reset • Power Connector:Pluggable Terminal Block, P: 5.08mm, female, 2pin |
| Internal I/O | • Debug Port (UART):1 (1 x 3, P : 2.54, 3.3V) • EDL Jumper:1 (1 x 3, P : 2.0) • CPU Fan Connector:1 (1 x 4, P : 2.54, for PWM Contorl, 12V) • eDP:1 (40pin, P : 0.5) • eDP Power Jumper:1 (2 x 3, P : 2.0) • GMSL Power:1 (1 x 4, P: 2.0, 12V 3A) • GPIO:8 (1 x 10, P : 1.0, 0.5A VCC, GND) • SPI:1 (1 x General SPI on 12-pin header, P:2.0, 3.3V)* • I2C:2 (1 x I2C on module, P:1.0, 3.3V ; 1 x I2C on 12-pin header, P:2.0)* • CAN FD:1 (1 x 3, P : 2.0) • COM:2 (1 x 9 P : 1.0, on module, 1 x 9 P : 1.0, on carrier board, RS232 / 422 / 485)* • USB 2.0:1(1 x 8, P : 1.0)* • Boot Mode Select:1 (Toggle Switch, 4 Poles)* • Sim Slot:Nano SIM (4FF)* |
| Power Requirement | Power Input Voltage:DC 9-36V (12V@2.6A) RTC Battery:CR2302 Coin Cell |
| Security | TPM2.0 |
| OS Support | Yocto Linux (Kernel 6.6); Ubuntu 24.04 (Kernel 6.8) |
| Other Features | • Watchdog Timer: Programmable watchdog to protect the system from crashes • Fan Supply : PWM Speed Control for CPU Fan on Carrier Board • System Monitoring : CPU Temperature, CPU Fan, Module Voltage, Current |
| Temperature | • Operating : -40°C ~ 85°C (Ta) • Storage : -40°C ~ 95°C (Ta) |
| Humidity | Operating & Storage : 5% to 95%, Non-condensing |
| Vibration | Operating:3G, IEC 60068-2-64, Random Vibration, 5 ~ 500Hz, 1hr/axis |
| Shock | Operating:30G, IEC 60068-2-27, Half Sine, 11ms Duration |
| ESD | EN61000-4-2, Air-15kV, Contact-8kV |
| Certification | CE / FCC Class B |
| Weight (g) | • Net Weight (g):1704 • Gross Weight (g):TBD |
| Dimensions (W x L x H/mm) | 146 x 102 x 56.99 mm |
| Note | * Indicates that the specifications differ from the EVT-stage design. |
BESTELLINFORMATIONEN
| P/N | Description |
| EXEC-Q911-00A1-W1 | COM-HPC Mini Starter Kit, Qualcomm IQ-9075, 128G UFS, 36G LPDDR5, DC 9-36V, -40 ~85°C |

