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DDR3 Mini ECC ULP

DDR3

ECC Unbuffered Memory

DDR3 Mini ECC ULP

Features

  • Suitable for small-size routers, switches, and bridges
  • Ultra low profile feature specialized for use in 1U system
  • Register that enhances clock, command, and control signals
  • ECC DIMM incorporates error correction and detection capabilities
  • Fully tested and optimized for stability and performance
  • Uses original IC to meet strict industrial standards
  • Operating Environment: 0°C ~ 85°C
  • RoHS Compliance and CE / FCC Certification
BORN FOR SUPERIOR PERFORMANCE

DDR3 Mini ECC ULP is an ultra low-profile industrial memory module that provides lasting performance and is designed for the server and networking markets and will fit in the smallest routers, switches, and bridges. The modules come equipped with 30μ” Gold Fingers and include single bit error correction. 2GB and 4GB capacities are available, as well as data transfer rates of 1600MT/s.

ULP modules are specialized for use in 1U systems, such as blade server data centers, where system height is lower than 1.18 inches. The design of these modules improves airflow inside the system and reduces thermal impact.

ECC function is designed to detect and correct single-bit errors that occur during data storage and transmission. ECC modules use Hamming Code or Triple Modular Redundancy for error detection and correction, and manage error corrections on their own, without requesting that the data source resend the original data.

PROVEN RELIABILITY THROUGH 3rd PARTY TESTING

Ensuring the durability and reliability of components is essential for meeting the demands of challenging environments. Our solutions undergo rigorous third-party testing, adhering to stringent industry standards. These tests validate the robustness of our products under extreme conditions, ensuring dependable performance across various applications.

 

Package Drop TestDrop Height 76 cm, ISTA-1A
DRAM Module Insert & Extract Test100 Cycles, EIA-364-9

TAILORED TO YOUR SPECIFIC NEEDS

SIDE FILL

Side Fill reinforces the connection between chips and the board, providing superior protection in environments with high vibration or mechanical stress.

CONFORMAL COATING

Conformal Coating applies a protective acrylic layer over the DRAM PCB, shielding it from harmful elements such as moisture, dust, and corrosive substances.

IMPLEMENTED WITH SUCCESS IN DYNAMIC ENVIRONMENTS

EDGE SERVER
EDGE SERVER

Designed for edge computing, our products ensure stable performance in harsh conditions, supporting real-time data processing at the edge device.

DATA CENTER
DATA CENTER

Driving the backbone of modern computing, our solutions deliver high performance and reliability for data-intensive operations.

COMMUNICATION
COMMUNICATION

Our solutions ensure reliable and uninterrupted performance, supporting networking and critical telecom infrastructure even under heavy loads.

SPECIFICATIONS

Model NameDDR3 Mini ECC ULP
DDR GenerationDDR3 Memory
DIMM TypeMini ECC ULP
Speed1600 MT/s
Density2GB, 4GB
FunctionECC Unbuffered Memory
Pin Number244pin
Bus Widthx72
Voltage1.35V, 1.5V
PCB Height0.7 Inches
Operating Temperature0°C ~ 85°C
30μ” Gold FingerY

ORDER INFORMATION

P/N

IC Config.

Rank

Temp.

Description

M3M0-2GMJOCPC

256M x 8

1R x 8

0°C ~ 85°C

DDR3 1600 2GB Mini ECC ULP

M3M0-2GMJOLPC

256M x 8

1R x 8

0°C ~ 85°C

DDR3L 1600 2GB Mini ECC ULP

M3M0-4GSSOCPC

512M x 8

1R x 8

0°C ~ 85°C

DDR3 1600 4GB Mini ECC ULP

M3M0-4GSSOLPC

512M x 8

1R x 8

0°C ~ 85°C

DDR3L 1600 4GB Mini ECC ULP


 

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